At present, the heat dissipation of LED applications is the biggest headache for LED manufacturers. The heat dissipation substrate is a medium that provides heat conduction. The LED → heat dissipation substrate → heat dissipation module can increase the area of the bottom of the LED and increase the heat dissipation area. It is mainly composed of copper foil circuit / ceramic powder + polymer / aluminum substrate.
The heat dissipation substrate has high thermal conductivity, safety, environmental protection and other functions in the LED industry application. The following introduces a substrate made of aluminum. Because aluminum has a high thermal conductivity and good heat dissipation, it can effectively extract internal heat. Aluminum substrate is a unique metal-based copper clad laminate with good thermal conductivity, electrical insulation performance and mechanical processing performance. When designing, the PCB should be as close as possible to the aluminum base, so as to reduce the thermal resistance generated by the potting part.